Real-time monitoring of metal stripping and deposition with EC-MP-SPR
Application Note #142
MP-SPR curves for the deposition of copper, measured at 670 nm wavelength for 2.5 minutes.
Multi-Parametric Surface Plasmon Resonance (MP-SPR) enables combined electrochemical and SPR measurements (EC-MP-SPR). In this study, MP-SPR was utilized to follow real-time copper deposition and stripping processes under constant current (galvanostatic) conditions. Process of deposition of copper in terms of layer thickness (d), refractive index (n) and adsorption coefficient (k) was determined with dedicated LayerSolver™ software.
Recommended instrument for this application
Further reading
- If you are interested in reading more, see AN#146.
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