Real-time monitoring of metal stripping and deposition with EC-MP-SPR

Application Note #142

Figure 2. MP-SPR curves for the deposition of copper, measuered at 670nm wavelength for 2,5 minutes.

Multi-Parametric Surface Plasmon Resonance (MP-SPR) enables combined electrochemical and SPR measurements (EC-MP-SPR). In this study, MP-SPR was utilized to follow real-time copper deposition and stripping processes under constant current (galvanostatic) conditions. Process of deposition of copper in terms of layer thickness (d), refractive index (n) and adosrption coeficient (k) was determined with dedicated LayerSolver™ software.

Recommended instrument for this application:

200_otso_small.jpg 400_KONTIO_LOGO_24012019_cropped.jpg 210_vasa_small.jpg 410A_KAURIS_instrument.jpg  220A_naali_small.jpg 420_ilves_small.jpg
200 OTSO 400 KONTIO 210A VASA  410A KAURIS  220A NAALI 420A ILVES 
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Further reading

  • Do you want to see MP-SPR instruments comparison? Click here.

  • Here are a few publications you can have a look at.

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