Electrochemical SPR of copper electrodeposition

Application Note #120

Langmuir-blodgett

 

"In situ monitoring of electrochemical reactions using SPR Navi 200"
SPR sensograms of copper deposition with cyclic voltametry using two different potential scanning rates.

Electrochemistry can be utilized as a detection method or driving force for chemical reactions. Combining electrochemistry with SPR can be utilized in monitoring electrochemical reactions in situ, or it can be used as an complementary detection method to provide additional informationa about the reaction.

In this experiment MP-SPR instrument (SPR Navi™ 200) was equipped with a electrochemical flow-cell and a potentiostat was attached. The electrodeposition of copper on standard gold sensor surfaces was measured by cyclic voltametry from 0.01 M CuSO4 solution with 0.1 M H2SO4 as carrier electrolyte.

The amount of deposited copper can be determined using Fresnel equations. The copper layer deposited during the 0.005 V/s scan rate was calculted to correspond to 1 nm thick unifrom copper layer, corresponding approximately to 900 ng/cm2 of deposited mass.

Parallel measurements of electrochemistry and MP-SPR ensure identical conditions of the measurements and enable in-situ measurments.

Recommended instrument for this application:

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Further reading

  • If you are interested in electrochemistry, you may view also AN#142 about copper electrochemical deposition and stripping. You may also like AN#146 about  characterization of single and multi-layer graphene in air.

  • Do you want to see how MP-SPR instrument work? Click here.
  • Do you want to see MP-SPR instruments comparison? Click here.
  • Here are a few publications you can have a look at.

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